Japan 
Vietnam
Electronic devices are increasingly evolving towards more compactness with higher performance. our chemistry responds effectively to the need to process printed boards or semiconductor circuits in more detail, more compactly with higher density to meet this evolutionary trend.
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Tel: 84-24-3875-9806/7/8
Email: sales.jcuvietnam@jcu-i.com
CHEMICAL FOR SEMICONDUCTOR WAFERS
| PROCESS | APPLICATION & FEATURES | PROCESS NAME | |
| Pretreatment | Electrolytic cleaning | Alkaline electrolytic cleaning. Non-silicate, non-chelate, low foaming type. Intended for various electronic parts and ic lead frames. Suitable for cathodic/anodic and pr cleaning. |
EBACLEAN IC-200RM |
| Etching | High speed etching agent for IC lead frames of 42-alloy. Halogen-, hydrogen peroxide- and phosphoric acid-free. Intended for high speed rack-less and coil-to-coil plating lines. |
EBAETCH IC-313N | |
| Electrolytic etching agent for copper and copper alloy. Intended for IC lead frames and coil-to-coil plating line. May be used for Corson alloy. Chelate- and halogen-free. Part of dissolved copper is removed by deposition on cathode plate. Has a long bath life. |
EBAETCH CA-40P | ||
| Plating | Tin plating (Semi bright) | Alkane sulfonic acid bath. Little change in stress in electrodeposits over time after plating assures good whisker suppression effect. Has excellent solderability and uniform semi-bright appearance may be obtained. |
EBASOLDER UT-55Ⅱ |
| Alkane sulfonic acid bath. Little change in stress in electrodeposits over time after plating assures good whisker suppression effect. Has excellent solderability and uniform semi-bright appearance may be obtained. Allows high speed plating under high current density. |
EBASOLDER UT-55HDⅡ | ||
| Tin-Silver Alloys (Semi bright) | Alkane sulfonic acid bath. Sn:Ag=99:1-95:5 Allows operation in a wide range of current density. Good uniformity in composition and good solderability. |
EBASOLDER SEⅡ | |
| Alkane sulfonic acid bath. Chelate-free Sn-Ag alloy bath. Good uniformity in composition and good solderability. Intended for barrel operation. |
EBASOLDER SE-BLⅡ | ||
| Rack stripping | For Tin-Lead Alloys | Electrolytic rack stripper for solder (Sn-Pb) alloy. Thanks to its being of electrolytic type, the amount of sludge generated is small and the bath has a long life. |
EBASTRIP IC-461 |
| For Tin-Silver Alloys | Soak rack stripper for tin-silver (Sn-Ag) alloy. Nitric acid is to be added separately and the amount of residual smut after stripping is small. NOx generation is comparatively small in amount. |
EBASTRIP SA-10T | |
| For Tin-Bitsmuth Alloys | Electrolytic rack stripper for tin-bismuth (Sn-Bi) alloy. Thanks to its being of electrolytic type, the amount of sludge generated is small and the bath has a long life. |
EBASTRIP IC-462W | |
| For Tin-Copper Alloys | Soak rack stripper for tin-copper (Sn-Cu) alloy. Can be applied to Sn. |
EBASTRIP ST-401NC | |
| Part stripping | For Tin-Silver Alloys | Part stripper for parts plated with Sn-Ag. Also applicable to Sn and Sn-Pb. Especially suited for 42-alloy. Fluoride-free. |
EBASTRIP SA-421 |
| Anti tarnish | For Tin and Tin Alloys | Excellent anti-tarnish effect after tin and tin-alloy plating without deterioration of solderability. | EBAFIN S-50 |